Micron Technology Invests $7 Billion in Singapore for Advanced HBM Packaging Facility

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Micron Technology has announced a significant investment of $7 billion in a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore. This facility, the first of its kind in the country, is expected to begin operations in 2026, with a substantial capacity expansion planned for 2027 to meet the growing demand driven by the AI boom.

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The investment will initially create 1,400 jobs, with plans to expand to 3,000 positions. These roles will include positions in packaging development, assembly, and test operations. The new facility aims to strengthen Singapore's semiconductor ecosystem and will feature sustainable technologies such as greenhouse gas abatement, water recycling, and waste circularity measures. The building will be highly automated, incorporating AI-based solutions, and designed to meet LEED certification requirements.

This investment aligns with Micron's broader strategy to enhance its manufacturing capabilities and support long-term NAND manufacturing requirements in Singapore. The facility will also provide flexibility in managing capacity ramps for both HBM and NAND facilities based on market demand.

The announcement underscores Micron's commitment to advancing its role in the global semiconductor industry and its strategic focus on key technological areas like AI and memory solutions.

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